Macro Cycle

Macro Cycle

By Ethan Brooks

Big Fund III’s 300B Yuan Allocation: Equipment, Materials, and HBM Breakdown

China’s third national semiconductor investment vehicle—commonly referred to as “Big Fund III”—marks a new phase in the country’s effort to build a more self‑sufficient and globally competitive chip ecosystem. With a planned war chest on the order of 300 billion yuan, the fund is widely expected to pivot from simply backing wafer capacity toward deeper, more targeted investments in equipment, materials, and memory technologies such as high‑bandwidth memory (HBM).